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1/8 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. s t epping mot o r driv er series low v o lt age s t epping motor drivers bd6382efv desc ri ptio n this series can drive the bipolar stepping motor used for paper feed carriages. it is a low power consumption bipolar pwm constant current-drive driver. it is suitable for the mobile dev ices of a battery drive by power save function. it contributes also to reduction of mounting area by ultra-thin and high heat-radiation (exposed metal type) htssop package. f e atu r e 1) low on resistance dmos output 2) pwm constant current control (self oscillation) 3) built-in spike noise cancel function (external noise filter is unnecessary) 4) power save function 5) built-in logic input pull-down resistor 6) power-on reset function 7) thermal shutdown circuit (tsd) 8) over current protection circuit (ocp) 9) under voltage lock out circuit (uvlo) 10) malfunction prevention at the time of no app lied power supply (ghost supply prevention) 11) electrostatic discharge: 4kv (hbm specification) 12) adjacent pins short protection 13) microminiature, ultra-thin and high heat-radiation (exposed metal type) htssop package a p p lic ati on mini printer, handy printer, monitoring ca mera, web camera, scanner, toy, and robot etc. a b s o lute maximum r a tings(t a= 25 ) item symbol ratings unit supply voltage vcc v cc -0.2 +7.0 v supply voltage vm v m -0.2 +15.0 v power dissipation pd 1.1 1 w 4.0 2 w input voltage for control pin v in -0.2 (v cc +0.3) v rnf maximum voltage v rnf 0.5 v maximum output current i out 0.8 3 a/ch operating temperature range t opr -40 +85 storage temperature range t stg -55 +150 junction temperature t jmax 150 1 70mm 70mm 1.6mm glass epoxy board. derating in done at 8.8mw/ for operating above ta=25 . 2 4-layer recommended board. derating in done at 32.0mw/ for operating above ta=25 . 3 do not exceed pd, aso and tjmax=150 . no.12009eat02 downloaded from: http:///
technical note 2/8 bd6382efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. o per ati ng c o n d i tio n s ( t a= -25 +75 ) item symbol ratings unit supply voltage vcc v cc 3.0 5.5 v supply voltage vm v m 4.0 13.5 v input voltage for control pin v in 0 v cc v output current (dc) i out 0.5 4 a/ch 4 do not exceed pd, aso e l ectr ic al c h a r act e rist ics applicable to bd6382efv(unless otherwise specified ta=25 , vcc=3.3v, vm=6.0v) item symbol limit unit conditions min. typ. max. w h ol e vcc current at standby i ccst - 0 10 a ps=l vcc current i cc - 1.6 3.0 ma ps=h, vlimx=0.5v vm current at standby i vmst - 0 10 a ps=l vm current i vm - 0.08 0.50 ma ps=h, vlimx=0.5v c o ntrol in put (ps, in 1a, in1b, in2a, in2b) h level input voltage v inh 2.0 - 3.3 v l level input voltage v inl 0 - 0.8 v h level input current i inh 15 30 60 av in =3v l level input current i inl -10 0 - av in =0v out put (out 1a, out 1 b, out 2 a, o u t 2 b) output on resistance r on - 1.2 1.5 i out = 0.3a, v m =6v sum of upper and lower output leak current i leak - - 10 a c u rr ent c ontr o l rnfx input current i rnf -40 -20 - a rnfx=0v sensex input current i sense -2.0 -0.1 - a sensex=0v vlimx input current i vlim -2.0 -0.1 - avlimx=0v vlimx input voltage range v vlim 0 - 0.5 v comparator offset voltage v ofs -10 - 10 mv noise cancel time t n 0.3 0.7 1.2 s r=39k , c=1000pf vref voltage v vref 0.97 1.00 1.03 v i vref =0~1ma downloaded from: http:///
technical note 3/8 bd6382efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. t e rminal function ? bl ock di ag ram ? ap pl icat io n c i rcu i t di a g ra m 1) bd6382efv pin no. pin name function pin no. pin name function 1 gnd ground terminal 13 rnf2 connection terminal of resistor for output current detection 2 ps power save terminal 3 vlim1 output current limit setting term inal 14 out2b h bridge output terminal 4 sense1 input terminal of current limit comp. 15 out2a h bridge output terminal 5 cr1 connection terminal of cr for setting pwm frequency 16 vm2 power supply terminal for motor 17 nc non connection 6 in1a logic input terminal 18 in2b logic input terminal 7 in1b logic input terminal 19 in2a logic input terminal 8 nc non connection 20 cr2 connection terminal of cr for setting pwm frequency 9 vm1 power supply terminal for motor 10 out1a h bridge output terminal 21 sense2 input terminal of current limit comp. 11 out1b h bridge output terminal 22 vlim 2 output current limit setting terminal 12 rnf1 connection terminal of resistor for output current detection 23 vref reference voltage output terminal 24 vcc power supply terminal fig.1 block diagram & application circuit diagram of bd6382efv resistor for current. detecting. setting range is 0.1 ? 1.0 refer to p.7 bypass capacitor. setting range is 10uf 470uf(electrolytic) 0.01uf 0.1uf (multilayer ceramic etc.) refer to p.6 set the pwm frequency. setting range is c:470pf 4700pf r:10k ? 100k refer to p.7 vm1 vlim2 cr2 vcc in1 a in1b cr1 in2 a in2b vlim1 out1b sense1 rnf1 vm2 sense2 out2b rnf2 39k 1000pf 39k 1000pf 0.3 0.3 predriver current limit comp. 9 cr timer current limit comp. cr timer predriver tsd uvlo gnd 20 6 7 5 19 18 11 4 12 16 15 21 14 13 10 47uf 0.1uf resistor for current. detecting. setting range is 0.1 ? 1.0 refer to p.7 4.7uf 0.1uf bypass capacitor. setting range is 4.7uf 47uf(electrolytic) 0.01uf 0.1uf(multilayer ceramic etc.) refer to p.6 vref 23 ps 2 logic 22 3 vref set the pwm frequency. setting range is c:470pf 4700pf r:10k ? 100k refer to p.7 you can devide the reference voltage by external resistor, and use it for output current limit setting. refer to p.7 ocp 24 1 out2a out1a downloaded from: http:///
technical note 4/8 bd6382efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. point s to noti ce for terminal de scri p ti on ps power save terminal ps can make circuit standby state and make motor output open. please be careful because there is a delay of 40 s(max.) before it is returned from standby state to normal state and the motor output becomes active at ps=l h. if you don't use power save mode, you may short ps terminal to vcc. ps state l standby state (reset) h active in1a,in1b,in2a,in2b logic input terminal these pins decide output state. input output ps in1a in2a in1b in2b out1a out2a out1b out2b l x x open open standby state (reset) h l l open open standby h h l h l forward h l h l h reverse h h h l l brake x: h or l pro t ecti on ci rcu i t s thermal shutdown (tsd) this ic has a built-in thermal shutdown circuit for therma l protection. when the ics chip temperature rises above 175 (typ.), the motor output becomes open. also, when the temperature returns to under 150 (typ.), it automatically returns to normal operation. however, even wh en tsd is in operation, if heat is continued to be added externally, heat overdrive can lead to destruction. over current protection (ocp) this ic has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted each other or v cc-output or motor output-gnd is shorted. this circuit latches the motor output to open condition when the regulated threshold current flows for 4 s (typ.). it returns with vcc po wer reactivation or a reset of the ps terminal. the over current protection circuits only ai m is to prevent the destructi on of the ic from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. therefore, sets should not be designed to take into account this circuits func tions. after ocp operating, if irregular situations continues and the return by power reactivation or a reset of the ps te rminal is carried out repeatly , then ocp operates repeatly and the ic may generate heat or otherwise deteriorate. when the l value of the wiring is great due to the wiring being long, after the over current has fl owed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there is a possibility of destruction. also, when current which is over the output current rating and under the ocp detection current flows, the ic can heat up to over tjmax=150 and can deteriorate, so current which exceeds the output rating should not be applied. under voltage lock out (uvlo) this ic has a built-in under voltage lock out function to pr event false operation such as ic output during power supply under voltage. when the applied voltage to the vcc terminal goes under 1.95v (typ.), the motor output is set to open. this switching voltage has a 0.25v (typ.) hysteresis to prevent false operation by noise etc. please be aware that this circuit does not operate during power save mode. false operation prevention function in no power supply (ghost supply prevention) if a logic control signal is input when there is no power suppl ied to this ic, there is a function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from the logic control input terminal to the vcc, to this ic or to another ics power supply. therefore, there is no chance of malfunction of the circuit even when voltage is supplied to the logic control input terminal while there is no power supply. downloaded from: http:///
technical note 5/8 bd6382efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. power dissipation htssop-b24 package htssop-b24 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. also, the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power dissipation. the back metal is shorted with the back side of the ic chip, being a gnd potential, theref ore there is a possibility for malfunction if it is shorted with any potent ial other than gnd, which shoul d be avoided. also, it is recommended that the back metal is soldered onto the gnd to short. please note that it has been assumed that this product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation efficiency. 3.0 2.0 1.0 100 125 4.0w 0 4 ambient temperature : ta[ ] power dissipation : pd[w] 4.0 measurement machine th156 kuwano electric measurement condition rohm board board size 70*70*1.6mm 3 (with through holes on the board) the exposed metal of the backside is connected to the board with solder. board 1-layer board(copper foil on the back 0mm 2 ) board 2-layer board(copper foil on the back 15*15mm 2 ) board 2-layer board(copper foil on the back 70*70mm 2 ) board 4-layer board(copper foil on the back 70*70mm 2 ) board ja = 113.6 /w board ja = 73.5 /w board ja = 44.6 /w board ja = 31.3 /w fig.2 htssop-b24 derating curve 2.8w 1.7w 1.1w 3 2 1 downloaded from: http:///
technical note 6/8 bd6382efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. usa ge not e s (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify br eaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute ma ximum ratings, consider adding circuit protection devices, such as fuses. (2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3) power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground section and supply li nes of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the power supply and the gnd terminal. when applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) gnd potential the potential of gnd pin must be minimu m potential in all operating conditions. (5) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. users should be aware that bd6382efv have been designed to expose their frames at the back of the package, and should be used with suitable heat dissipation treatment in th is area to improve dissipation. as large a dissipation pattern should be taken as possible, not only on the front of the baseboard but al so on the back surface. (6) inter-pin shorts and mounting errors when attaching to a printed circuit board, pay close attention to the direction of the ic and displacement. improper attachment may lead to destruction of the ic. there is also possibility of destruction from short circuits which can be caused by foreign matter entering between out puts or an output and the power supply or gnd. (7) operation in a strong electric field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. (8) aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (9) thermal shutdown circuit the ic has a built-in thermal shutdown circuit (tsd circuit). if the chip te mperature becomes tjmax=150 , and higher, coil output to the motor will be open. the tsd circuit is des igned only to shut the ic of f to prevent runaway thermal operation. it is not designed to protect or indemnify peri pheral equipment. do not use the tsd function to protect peripheral equipment. tsd on temperature [ ] (typ.) hysteresis temperature [ ] (typ.) 175 25 (10) inspection of the application board during inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the ic, t herefore an electrical discharge should be performed after each process. also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. furthermore, when connecti ng to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. downloaded from: http:///
technical note 7/8 bd6382efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. (11) input terminal of ic this ic is a monolithic ic, and between each element there is a p+ isolation for element partition and a p substrate. this p layer and each elements n layer make up the p-n junction, and various parasitic elements are made up. for example, when the resistance and transistor are connected to the terminal as shown in figure 3, when gnd (terminal a) at the resistance and gnd (terminal b) at the transistor (npn), the p-n junction operates as a parasitic diode. also, when gnd (terminal b) at the transistor (npn) the parasitic npn transistor operates with the n la yers of other elements close to the aforementioned parasitic diode. because of the ics structure, the creation of parasitic elements is inevitable from the electrical potential relationship. the operation of parasitic elements causes interference in circ uit operation, and can lead to malfunction and destruction. therefore, be careful not to use it in a way which causes t he parasitic elements to operate, such as by applying voltage that is lower than the gnd (p substrate) to the input terminal. fig.3 pattern diagram of parasitic element (12) ground wiring patterns when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern potential of an y external components, either. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element downloaded from: http:///
technical note 8/8 bd6382efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. or der in g p a rt n u mb er b d 6 3 8 2 ef v -e 2 ?` efv=htssop-b24 ?`?? e2: `???` (unit : mm) htssop-b24 0.65 1.0max 0.85 0.05 0.08 0.05 0.24 +0.05 - 0.04 0.08 m s 0.08 1.0 0.2 0.53 0.15 0.17 +0.05 - 0.03 4 + 6 4 s 24 13 11 2 0.325 (3.4) (5.0) 7.8 0.1 7.6 0.2 5.6 0.1 (max 8.15 include burr) 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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